Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13235171Application Date: 2011-09-16
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Publication No.: US09029931B2Publication Date: 2015-05-12
- Inventor: Yoshiyuki Kawashima , Koichi Toba
- Applicant: Yoshiyuki Kawashima , Koichi Toba
- Applicant Address: JP Kawasaki-shi
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi
- Agency: Miles & Stockbridge P.C.
- Priority: JP2010-212036 20100922
- Main IPC: H01L29/788
- IPC: H01L29/788 ; H01L29/66 ; H01L27/115 ; H01L29/792 ; H01L29/423

Abstract:
An improvement is achieved in the performance of semiconductor device including a nonvolatile memory. In a split-gate nonvolatile memory, between a memory gate electrode and a p-type well and between a control gate electrode and the memory gate electrode, an insulating film is formed. Of the insulating film, the portion between the lower surface of the memory gate electrode and the upper surface of a semiconductor substrate has silicon oxide films, and a silicon nitride film interposed between the silicon oxide films. Of the insulating film, the portion between a side surface of the control gate electrode and a side surface of the memory gate electrode is formed of a silicon oxide film, and does not have the silicon nitride film.
Public/Granted literature
- US20120068243A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-03-22
Information query
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