Invention Grant
- Patent Title: Semiconductor structure and method for forming the same
- Patent Title (中): 半导体结构及其形成方法
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Application No.: US13425221Application Date: 2012-03-20
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Publication No.: US09029950B2Publication Date: 2015-05-12
- Inventor: Chien-Wen Chu , Wing-Chor Chan , Shyi-Yuan Wu
- Applicant: Chien-Wen Chu , Wing-Chor Chan , Shyi-Yuan Wu
- Applicant Address: TW Hsinchu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L21/84
- IPC: H01L21/84 ; H01L27/12 ; H01L29/78

Abstract:
A semiconductor structure and a method for forming the same are provided. The semiconductor structure comprises a substrate, a first source/drain region, a second source/drain region, a first stack structure and a second stack structure. The first source/drain region is formed in the substrate. The second source/drain region is formed in the substrate. The first stack structure is on the substrate between the first source/drain region and the second source/drain region. The first stack structure comprises a first dielectric layer and a first conductive layer on the first dielectric layer. The second stack structure is on the first stack structure. The second stack structure comprises a second dielectric layer and a second conductive layer on the second dielectric layer.
Public/Granted literature
- US20130249007A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2013-09-26
Information query
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