Invention Grant
- Patent Title: Semiconductor structure and method of manufacturing the same
- Patent Title (中): 半导体结构及其制造方法
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Application No.: US13450888Application Date: 2012-04-19
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Publication No.: US09029952B2Publication Date: 2015-05-12
- Inventor: Chih-Ling Hung , Chien-Wen Chu , Hsin-Liang Chen , Wing-Chor Chan
- Applicant: Chih-Ling Hung , Chien-Wen Chu , Hsin-Liang Chen , Wing-Chor Chan
- Applicant Address: TW Hsinchu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L29/66 ; H01L29/735 ; H01L29/08 ; H01L29/10

Abstract:
A semiconductor structure includes a substrate, a first well having a first conductive type, a second well having a second conductive type, a body region, a first doped region, a second doped region, a third doped region and a field plate. The first and second wells are formed in the substrate. The body region is formed in the second well. The first and second doped regions are formed in the first well and the body region, respectively. The second and first doped regions have the same polarities, and the dopant concentration of the second doped region is higher than that of the first doped region. The third doped region is formed in the second well and located between the first and second doped regions. The third and first doped regions have reverse polarities. The field plate is formed on the surface region between the first and second doped regions.
Public/Granted literature
- US20130277805A1 SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-10-24
Information query
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