Invention Grant
- Patent Title: Integrated circuit package system with internal stacking module
- Patent Title (中): 具有内部堆叠模块的集成电路封装系统
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Application No.: US13563598Application Date: 2012-07-31
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Publication No.: US09030006B2Publication Date: 2015-05-12
- Inventor: Seng Guan Chow , Heap Hoe Kuan , Reza Argenty Pagaila
- Applicant: Seng Guan Chow , Heap Hoe Kuan , Reza Argenty Pagaila
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/31 ; H01L21/56 ; H01L23/552 ; H01L25/03 ; H01L25/065 ; H01L25/10 ; H01L25/16 ; H01L23/498 ; H01L23/538 ; H01L23/00
Abstract:
An integrated circuit package system includes: providing an integrated circuit substrate; forming an internal stacking module coupled to the integrated circuit substrate including: forming a flexible substrate, coupling a stacking module integrated circuit to the flexible substrate, and bending a flexible extension over the stacking module integrated circuit; and molding a package body on the integrated circuit substrate and the internal stacking module.
Public/Granted literature
- US20120292750A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERNAL STACKING MODULE Public/Granted day:2012-11-22
Information query
IPC分类:
