Invention Grant
- Patent Title: Adhesion promoting composition for metal leadframes
- Patent Title (中): 金属引线框架的粘合促进组合物
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Application No.: US13954328Application Date: 2013-07-30
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Publication No.: US09030008B2Publication Date: 2015-05-12
- Inventor: Nilesh Kapadia
- Applicant: MacDermid Acumen, Inc.
- Agency: Carmody Torrance Sandak & Hennessey LLP
- Main IPC: C09D5/00
- IPC: C09D5/00 ; C09J5/02 ; C09K13/06 ; H01L23/31 ; H01L23/495 ; C23F1/18

Abstract:
A process for increasing the adhesion of a polymeric material to a metal surface, the process comprising contacting the metal surface with an adhesion promoting composition comprising: 1) an oxidizer; 2) an inorganic acid; 3) a corrosion inhibitor; and 4) an organic phosphonate; and thereafter b) bonding the polymeric material to the metal surface. The organic phosphonate aids in stabilizing the oxidizer and organic components present in the bath and prevents decomposition of the components, thereby increasing the working life of the bath, especially when used with copper alloys having a high iron content.
Public/Granted literature
- US20130312635A1 Adhesion Promoting Composition for Metal Leadframes Public/Granted day:2013-11-28
Information query
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