Invention Grant
- Patent Title: Light emitting device, electronic appliance, and method for manufacturing light emitting device
- Patent Title (中): 发光装置，电子设备及制造发光装置的方法
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Application No.: US13868228Application Date: 2013-04-23
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Publication No.: US09030097B2Publication Date: 2015-05-12
- Inventor: Yoshiharu Hirakata , Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2003-433025 20031226
- Main IPC: H05B33/04
- IPC: H05B33/04 ; H01J1/62 ; H01L51/52 ; H01L33/52 ; H01L27/32 ; H01L51/00 ; H01L51/56
Abstract:
To provide a light emitting device that has a structure in which a light emitting element is sandwiched by two substrates to prevent moisture from penetrating into the light emitting element, and a method for manufacturing thereof. In addition, a gap between the two substrates can be controlled precisely. In the light emitting device according to the present invention, an airtight space surrounded by a sealing material with a closed pattern is kept under reduced pressure by attaching the pair of substrates under reduced pressure. A columnar or wall-shaped structure is formed between light emitting regions inside of the sealing material, in a region overlapping with the sealing material, or in a region outside of the sealing material so that the gap between the pair of substrates can be maintained precisely.
Public/Granted literature
- US20130234123A1 Light Emitting Device, Electronic Appliance, and Method for Manufacturing Light Emitting Device Public/Granted day:2013-09-12
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