Invention Grant
US09030217B2 Semiconductor wafer and method for auto-calibrating integrated circuit chips using PLL at wafer level
有权
半导体晶片和方法,用于在晶片级使用PLL自动校准集成电路芯片
- Patent Title: Semiconductor wafer and method for auto-calibrating integrated circuit chips using PLL at wafer level
- Patent Title (中): 半导体晶片和方法,用于在晶片级使用PLL自动校准集成电路芯片
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Application No.: US13605554Application Date: 2012-09-06
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Publication No.: US09030217B2Publication Date: 2015-05-12
- Inventor: Hyunseok Kim , Su Na Choi , Heyung Sub Lee , Cheol Sig Pyo
- Applicant: Hyunseok Kim , Su Na Choi , Heyung Sub Lee , Cheol Sig Pyo
- Applicant Address: KR Daejeon
- Assignee: Electronics and Telecommunications Research Institute
- Current Assignee: Electronics and Telecommunications Research Institute
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2012-0042305 20120423
- Main IPC: G06K19/07
- IPC: G06K19/07

Abstract:
In integrated circuit chips that are used for RFID, a method of calibrating an operation frequency that is generated in an operation frequency generator and a semiconductor wafer including a calibration circuit are provided. The method of calibrating an operation frequency of integrated circuit chips includes: supplying DC power to the integrated circuit chips; selecting an integrated circuit chip to perform calibration of an operation frequency; receiving an operation frequency that is generated in the selected integrated circuit chip; calculating a difference between a phase of the operation frequency and a phase of a calibration target frequency; generating a frequency calibration value of the operation frequency using the phase difference; transmitting a control signal including the frequency calibration value to the integrated circuit chip; and releasing a selection of the integrated circuit chip in which calibration of the operation frequency is complete.
Public/Granted literature
- US20130278309A1 SEMICONDUCTOR WAFER AND METHOD FOR AUTO-CALIBRATING INTEGRATED CIRCUIT CHIPS USING PLL AT WAFER LEVEL Public/Granted day:2013-10-24
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