Invention Grant
- Patent Title: Touch panel and producing method for via electrode
- Patent Title (中): 触摸屏及通孔电极的制作方法
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Application No.: US13802458Application Date: 2013-03-13
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Publication No.: US09030432B2Publication Date: 2015-05-12
- Inventor: Sung Yeol Park , Suk Jin Ham , Jung Eun Noh
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: Ladas & Parry, LLP
- Priority: KR10-2012-0154868 20121227
- Main IPC: G06F3/041
- IPC: G06F3/041 ; G06F1/16 ; G06F3/044
Abstract:
Disclosed herein a touch panel and a producing method for a via electrode. Touch sensitivity may be improved by forming a via hole in a cover glass and then filling a via electrode into the via hole to thereby narrow an interval between a touch point of a user and an electrode layer.
Public/Granted literature
- US20140184933A1 TOUCH PANEL AND PRODUCING METHOD FOR VIA ELECTRODE Public/Granted day:2014-07-03
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