Invention Grant
- Patent Title: Thin substrate electrostatic chuck system and method
- Patent Title (中): 薄基板静电吸盘系统及方法
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Application No.: US13485975Application Date: 2012-06-01
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Publication No.: US09030797B2Publication Date: 2015-05-12
- Inventor: Ewald Wiltsche , Peter Zupan
- Applicant: Ewald Wiltsche , Peter Zupan
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01T23/00
- IPC: H01T23/00 ; H02N13/00 ; H01L21/683
Abstract:
In various aspects of the disclosure, a semiconductor substrate processing system may include an electrostatic chuck for holding a semiconductor substrate attached to an electrically insulating carrier; and an AC power supply electrically coupled to the electrostatic chuck.
Public/Granted literature
- US20130321973A1 THIN SUBSTRATE ELECTROSTATIC CHUCK SYSTEM AND METHOD Public/Granted day:2013-12-05
Information query
