Invention Grant
- Patent Title: Electronic device chassis and electronic device
- Patent Title (中): 电子设备机箱和电子设备
-
Application No.: US13680145Application Date: 2012-11-19
-
Publication No.: US09030811B2Publication Date: 2015-05-12
- Inventor: Akira Ikezawa
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Posz Law Group, PLC
- Priority: JP2012-000923 20120106
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00 ; A47G1/10 ; H05K5/02

Abstract:
An electronic device chassis includes a base plate for disposing an electronic device circuit thereon, and a cover for the electronic device circuit housing. The base plate includes a bottom portion and a wall portion. The wall portion includes a screw fastening portion including a contact surface that contacts the cover. The cover includes a screw hole for attaching the base plate. The contact surface of the screw fastening portion is higher than an upper surface other than the contact surface of the wall portion. The upper surface portion covers the side of the housing space facing the base plate. The external side surface cover is provided at a peripheral edge of the upper surface cover portion, and extends toward the base plate so as to be longer than a difference between the contact surface of the screw fastening portion and the upper surface of the wall portion.
Public/Granted literature
- US20130176664A1 ELECTRONIC DEVICE CHASSIS AND ELECTRONIC DEVICE Public/Granted day:2013-07-11
Information query