Invention Grant
- Patent Title: Switch having dedicated stacking link
- Patent Title (中): 交换机具有专用堆叠链路
-
Application No.: US13453373Application Date: 2012-04-23
-
Publication No.: US09031065B2Publication Date: 2015-05-12
- Inventor: Nick E. Demmon , Sundeep S Nagra
- Applicant: Nick E. Demmon , Sundeep S Nagra
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Dicke, Billig & Czaja
- Main IPC: H04L12/775
- IPC: H04L12/775 ; H04L12/927 ; H04L12/931

Abstract:
A first switch includes a processor and a memory communicatively coupled to the processor. The memory stores instructions causing the processor, after execution of the instructions by the processor, to establish a first stacking link between a first stacking port of the first switch and a first stacking port of a second switch, establish a second stacking link between a second stacking port of the first switch and a first stacking port of a third switch, and dedicate the first stacking link to a first class of traffic between the first switch and the second switch.
Public/Granted literature
- US20130279502A1 SWITCH HAVING DEDICATED STACKING LINK Public/Granted day:2013-10-24
Information query