Invention Grant
- Patent Title: Electroformed housings for electronic devices
- Patent Title (中): 用于电子设备的电铸外壳
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Application No.: US13708683Application Date: 2012-12-07
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Publication No.: US09031276B2Publication Date: 2015-05-12
- Inventor: Peter N. Russell-Clarke
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Van Court & Aldridge LLP
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10 ; H04R31/00 ; C25D1/02 ; C25D1/20 ; H04R1/02
Abstract:
Electroformed housings for electronic devices and methods for making the same are provided. An electronic device is provided having at least one electronic part and an electroformed housing constructed from a metal that encloses the at least one electronic part.
Public/Granted literature
- US20140161298A1 ELECTROFORMED HOUSINGS AND METHODS FOR MAKING THE SAME Public/Granted day:2014-06-12
Information query
