Invention Grant
- Patent Title: Conductive film manufacturing method, conductive film, and recording medium
- Patent Title (中): 导电膜制造方法,导电膜和记录介质
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Application No.: US13638541Application Date: 2011-03-28
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Publication No.: US09031310B2Publication Date: 2015-05-12
- Inventor: Takashi Wakui , Hideyasu Ishibashi , Osamu Shimazaki
- Applicant: Takashi Wakui , Hideyasu Ishibashi , Osamu Shimazaki
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2010-084645 20100331; JP2010-084647 20100331
- International Application: PCT/JP2011/057582 WO 20110328
- International Announcement: WO2011/125597 WO 20111013
- Main IPC: G06K9/00
- IPC: G06K9/00 ; H05K9/00

Abstract:
Disclosed is a method for manufacturing a conductive film in which a mesh pattern comprising a wire material is provided on a base material. Also disclosed are a conductive film and a recording medium. Image data representing a mesh pattern is created on the basis of a plurality of selected positions. On the basis of said image data, an evaluation value which quantifies noise characteristics of the mesh pattern is computed. On the basis of the computed evaluation value and prescribed evaluation conditions, one image datum is chosen as an output image datum.
Public/Granted literature
- US20130028503A1 CONDUCTIVE FILM MANUFACTURING METHOD, CONDUCTIVE FILM, AND RECORDING MEDIUM Public/Granted day:2013-01-31
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