Invention Grant
- Patent Title: Optical element package and manufacturing method thereof
- Patent Title (中): 光学元件封装及其制造方法
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Application No.: US13598822Application Date: 2012-08-30
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Publication No.: US09031367B2Publication Date: 2015-05-12
- Inventor: Kai-Wen Wu , Tai-Cherng Yu
- Applicant: Kai-Wen Wu , Tai-Cherng Yu
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: TW100144182A 20111201
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/30 ; G02B6/36 ; G02B6/42

Abstract:
An optical element package includes an optical wave guide array, at least one optical assembly and at least one optical transmission member. The optical wave guide array has a reflection groove. The reflection groove includes a reflection surface. The at least one optical assembly is positioned on the optical wave guide array adjacent to the reflection surface. The at least one optical transmission member is positioned on the optical wave guide array, and is optically coupled with the reflection surface. The optical signals emitted by the at least one optical assembly are reflected by the reflection surface and then reaching the at least one optical transmission member for transmission.
Public/Granted literature
- US20130142484A1 OPTICAL ELEMENT PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-06-06
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