Invention Grant
- Patent Title: Lightwave circuit and method for manufacturing same
- Patent Title (中): 光波电路及其制造方法
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Application No.: US14007085Application Date: 2011-11-21
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Publication No.: US09031373B2Publication Date: 2015-05-12
- Inventor: Seo Young Lee , Hyung Jong Lee
- Applicant: Seo Young Lee , Hyung Jong Lee
- Applicant Address: KR Subuk-Myeon
- Assignee: Seo Young Lee
- Current Assignee: Seo Young Lee
- Current Assignee Address: KR Subuk-Myeon
- Agency: The Webb Law Firm
- Priority: KR10-2011-0026838 20110325
- International Application: PCT/KR2011/008886 WO 20111121
- International Announcement: WO2012/134025 WO 20121004
- Main IPC: G02B6/10
- IPC: G02B6/10 ; G02B6/26 ; G02B6/125 ; G02B6/136

Abstract:
Provided are a lightwave circuit and a method of manufacturing the same. The lightwave circuit includes a first substrate having an engraved core formation groove which is formed on an upper portion of the first substrate, a core layer which is formed inside the engraved core formation groove, a BPSG bonding layer which is formed on the first substrate including the core layer, and a second substrate which is formed on the BPSG bonding layer. Accordingly, light loss and branching uniformity of the lightwave circuit are effectively improved, and the lightwave circuit is manufactured simply and inexpensively while also further improving light loss and branching uniformity of the lightwave circuit.
Public/Granted literature
- US20140023320A1 Lightwave Circuit and Method for Manufacturing Same Public/Granted day:2014-01-23
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