Invention Grant
- Patent Title: Support structure for electronic device
- Patent Title (中): 电子设备支撑结构
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Application No.: US13170337Application Date: 2011-06-28
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Publication No.: US09031621B2Publication Date: 2015-05-12
- Inventor: Quan-Chang Cheng , Chia-Te Yu , Lin-Lin Pan , Cong-Bing Zhou
- Applicant: Quan-Chang Cheng , Chia-Te Yu , Lin-Lin Pan , Cong-Bing Zhou
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201010602342 20101223
- Main IPC: H04M1/00
- IPC: H04M1/00 ; F16M13/00 ; F16M11/04 ; F16M11/10 ; G06F1/16
Abstract:
A support structure is used for supporting an electronic device. The support structure includes a main body sleeved on a side portion of the electronic device and a supporting member rotatably connected to the main body. The supporting member can rotate relative to the main body to form an included angle for supporting the electronic device.
Public/Granted literature
- US20120162102A1 SUPPORT STRUCTURE FOR ELECTRONIC DEVICE Public/Granted day:2012-06-28
Information query
