Invention Grant
- Patent Title: Electronic device employing connecting mechanism
- Patent Title (中): 采用连接机构的电子设备
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Application No.: US13846932Application Date: 2013-03-18
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Publication No.: US09031622B2Publication Date: 2015-05-12
- Inventor: Tai-Shan Zhu , Che-Yu Chou , Wen-Chih Lan , Hai-Qian Ge
- Applicant: Fu Tai Hua Industry (Shenzhen) Co., Ltd. , Hon Hai Precision Industry Co., Ltd.
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201210085972 20120328
- Main IPC: H04M1/00
- IPC: H04M1/00 ; H05K5/03 ; H04M1/02

Abstract:
An electronic device includes a housing defining a receiving space framed by a plurality of side walls with an opening defined on a top surface of the housing. A cover is movable relative to the top surface. A connecting mechanism connects the housing with the cover. The connecting mechanism includes a transmission apparatus received in the housing and is exposed out of the housing via the opening, engaging with the cover, a moveable position apparatus is assembled with the transmission apparatus moving along the transmission apparatus, a latching apparatus is arranged on one side wall of the housing to latch the position apparatus. When the cover is moved to a first side of the housing, the position apparatus latches the latching apparatus. When the latching apparatus is released from the position apparatus, the cover slides to a second side opposite to the first side of the housing automatically.
Public/Granted literature
- US20130258566A1 ELECTRONIC DEVICE EMPLOYING CONNECTING MECHANISM Public/Granted day:2013-10-03
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