Invention Grant
- Patent Title: Clamp device
- Patent Title (中): 夹具装置
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Application No.: US13634941Application Date: 2011-04-27
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Publication No.: US09033323B2Publication Date: 2015-05-19
- Inventor: Takayuki Kawakami
- Applicant: Takayuki Kawakami
- Applicant Address: JP Hyogo
- Assignee: Pascal Engineering Corporation
- Current Assignee: Pascal Engineering Corporation
- Current Assignee Address: JP Hyogo
- Agency: Jordan and Hamburg LLP
- Priority: JP2010-108089 20100510
- International Application: PCT/JP2011/060222 WO 20110427
- International Announcement: WO2011/142257 WO 20111117
- Main IPC: B23Q3/06
- IPC: B23Q3/06 ; B23Q1/00

Abstract:
A clamp device includes a clamp main body, an engagement assembly, a clamp rod, a drive mechanism, and a support mechanism. The engagement assembly can be changed over between a diameter-expanded state in which it engages with an inner circumferential surface of an aperture in a workpiece, and a diameter-reduced state in which it does not so engage. The clamp rod is engaged with an interior of the engagement assembly. The drive mechanism drives the clamp rod to and from the clamp main body. The support mechanism supports the engagement assembly with a pneumatic force of pressurized air. At least a part of the pneumatic force is released after the engagement assembly has been expanded in diameter.
Public/Granted literature
- US20130042443A1 CLAMP DEVICE Public/Granted day:2013-02-21
Information query
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