Invention Grant
US09033623B2 Tool radius adjusting method in machine tool and machine tool for practicing the method
有权
用于实施该方法的机床和机床中的刀具半径调整方法
- Patent Title: Tool radius adjusting method in machine tool and machine tool for practicing the method
- Patent Title (中): 用于实施该方法的机床和机床中的刀具半径调整方法
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Application No.: US13509911Application Date: 2010-11-10
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Publication No.: US09033623B2Publication Date: 2015-05-19
- Inventor: Eiji Nakamura , Norikazu Sawaki , Akihiko Kadota , Takashi Yokoyama , Yasuhiro Komai
- Applicant: Eiji Nakamura , Akihiko Kadota , Takashi Yokoyama , Yasuhiro Komai , Harumi Sawaki , Shun Sawaki , Aya Sawaki , Taku Sawaki
- Applicant Address: JP Osaka-shi
- Assignee: JTEKT CORPORATION
- Current Assignee: JTEKT CORPORATION
- Current Assignee Address: JP Osaka-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-261399 20091116
- International Application: PCT/JP2010/069983 WO 20101110
- International Announcement: WO2011/058989 WO 20110519
- Main IPC: B23B29/034
- IPC: B23B29/034 ; B23B35/00

Abstract:
At a contact step in a tool radius adjusting method, a reference portion of a movable body provided radially movably on a housing of a boring tool and a position adjusting reference member fixed on a machine tool are brought into contact by sliding the movable body relative to the housing so that the position of a cutting blade comes to a predetermined position in a direction to go away from a rotational axis. Then, at an adjusting step, the position of the cutting blade relative to the rotational axis is adjusted by changing the relative position between a tool spindle holding the boring tool and the position adjusting reference member in a direction to come close to each other by drive mechanisms of the machine tool used for positioning a spindle head with the tool spindle relative to a workpiece in machining the workpiece with the cutting blade.
Public/Granted literature
- US20130064616A1 TOOL RADIUS ADJUSTING METHOD IN MACHINE TOOL AND MACHINE TOOL FOR PRACTICING THE METHOD Public/Granted day:2013-03-14
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