Contact pads on structures such as printed circuits may be coupled to each other using printed circuit connectors such as board-to-board connectors. A printed circuit connector may have interlocking metal frame structures. The metal frame structures may be soldered to traces on the printed circuits. Rectangular openings in the metal frame structures may receive a rectangular contact array structure that is separate from the metal frame structures. The contact array structure may include a dielectric carrier structure and an array of conductive contacts. The dielectric carrier structure may align the contacts with respect to pads on the printed circuits to which the metal frame structures are soldered. The contacts may be formed from metal spring structures or conductive elastomeric structures that are compressed between respective printed circuit contact pads when the metal frame structures of a printed circuit connector are attached to each other.