Invention Grant
- Patent Title: Grounding clamp
- Patent Title (中): 接地夹
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Application No.: US13632126Application Date: 2012-09-30
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Publication No.: US09033731B2Publication Date: 2015-05-19
- Inventor: Shayan Malek , Jared M. Kole , Richard H. Dinh
- Applicant: Apple, Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Womble Carlyle Sandridge & Rice, LLP
- Main IPC: H01R24/50
- IPC: H01R24/50 ; H01R4/02 ; H01R9/05
Abstract:
A clamping apparatus includes a base, a vertical support member coupled to the base, and a head member coupled to the vertical support member. The head member is configured to receive and engage a portion of a coaxial cable. Additionally, the base is configured to engage through a through hole or slot arranged through a substrate and provide electrical communication between a portion of the coaxial cable and the substrate.
Public/Granted literature
- US20140011399A1 GROUNDING CLAMP Public/Granted day:2014-01-09
Information query
