Invention Grant
- Patent Title: Method of manufacturing grooved chemical mechanical polishing layers
- Patent Title (中): 开槽化学机械抛光层的方法
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Application No.: US13628364Application Date: 2012-09-27
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Publication No.: US09034063B2Publication Date: 2015-05-19
- Inventor: Jeffrey James Hendron , Kenneth Vavala , Jeffrey Borcherdt Miller , Brian T. Cantrell , James T. Murnane , Kathleen McHugh , George H. McClain , Durron A. Hutt , Robert A. Brady , Christopher A. Young
- Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Applicant Address: US DE Newark
- Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Current Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Current Assignee Address: US DE Newark
- Agent Thomas S. Deibert
- Main IPC: B24D11/00
- IPC: B24D11/00 ; B24B37/26 ; B24D18/00
Abstract:
A method of manufacturing grooved polishing layers for use in chemical mechanical polishing pads is provided, wherein the formation of defects in the polishing layers are minimized.
Public/Granted literature
- US20140083018A1 Method of manufacturing grooved chemical mechanical polishing layers Public/Granted day:2014-03-27
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