Invention Grant
- Patent Title: Hem flange joint
- Patent Title (中): 下摆法兰接头
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Application No.: US12448493Application Date: 2007-12-21
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Publication No.: US09034135B2Publication Date: 2015-05-19
- Inventor: Jan Olaf Schulenburg , Michael Gutgsell , Yolanda Maurer
- Applicant: Jan Olaf Schulenburg , Michael Gutgsell , Yolanda Maurer
- Applicant Address: CH Baar
- Assignee: SIKA TECHNOLOGY AG
- Current Assignee: SIKA TECHNOLOGY AG
- Current Assignee Address: CH Baar
- Agency: Oliff PLC
- Priority: EP06126790 20061221; CH1311/07 20070822
- International Application: PCT/EP2007/064417 WO 20071221
- International Announcement: WO2008/077918 WO 20080703
- Main IPC: B32B3/04
- IPC: B32B3/04 ; B32B37/12 ; B62D27/02 ; C09J5/06
Abstract:
The present invention relates to a method of producing an edging-fold bond. For this purpose use is made more particularly of high-viscosity adhesives. The method features reduced bubble formation within the edging fold and also within the sealant (where present) that seals the edging-fold seam. More particularly the adhesive comprises spacers which further reinforce this effect.
Public/Granted literature
- US20100266809A1 HEM FLANGE JOINT Public/Granted day:2010-10-21
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