Invention Grant
US09034137B2 In-situ, multi-stage debulk, compaction, and single stage curing of thick composite repair laminates
有权
厚层复合修复层压板的原位多阶段减粘，压实和单阶段固化
- Patent Title: In-situ, multi-stage debulk, compaction, and single stage curing of thick composite repair laminates
- Patent Title (中): 厚层复合修复层压板的原位多阶段减粘，压实和单阶段固化
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Application No.: US12742568Application Date: 2008-11-26
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Publication No.: US09034137B2Publication Date: 2015-05-19
- Inventor: Denver R. Whitworth , Vance N. Cribb , Dumitru R. Jitariu
- Applicant: Denver R. Whitworth , Vance N. Cribb , Dumitru R. Jitariu
- Applicant Address: US RI Providence
- Assignee: Textron Innovations Inc.
- Current Assignee: Textron Innovations Inc.
- Current Assignee Address: US RI Providence
- Agent James E. Walton; Richard G. Eldredge
- International Application: PCT/US2008/084984 WO 20081126
- International Announcement: WO2009/070737 WO 20090604
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B32B37/00 ; B28B1/26 ; B29C45/00 ; B29C47/00 ; B29C43/02 ; B29C49/00 ; B29C51/00 ; B32B15/00 ; B29C39/14 ; B29C43/10 ; B28B21/36 ; A01J21/00 ; A01J25/12 ; A21C3/00 ; B29B11/06 ; A23P1/00 ; B29C73/10 ; B32B43/00 ; B29C37/00 ; B32B38/10
Abstract:
A method for fabricating a repair laminate for a composite part having an exposed surface includes applying a bonding material to the exposed surface and forming an uncured ply stack assembly on the bonding material. The uncured ply stack assembly is formed by forming and compacting a series of uncured ply stacks. The ply stack assembly and bonding material are then cured.
Public/Granted literature
- US20100258235A1 In-Situ, Multi-Stage Debulk, Compaction, and Single Stage Curing of Thick Composite Repair Laminates Public/Granted day:2010-10-14
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