Invention Grant
- Patent Title: Method for producing photonic wire bonds
- Patent Title (中): 光子线接合方法
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Application No.: US13385505Application Date: 2012-02-23
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Publication No.: US09034222B2Publication Date: 2015-05-19
- Inventor: Christian Koos , Wolfgang Freude , Nicole Lindenmann , Juerg Leuthold
- Applicant: Christian Koos , Wolfgang Freude , Nicole Lindenmann , Juerg Leuthold
- Applicant Address: DE Karlsruhe
- Assignee: KARLSRUHE INSTITUT FUER TECHNOLOGIE
- Current Assignee: KARLSRUHE INSTITUT FUER TECHNOLOGIE
- Current Assignee Address: DE Karlsruhe
- Agency: Venable LLP
- Agent Robert Kinberg
- Main IPC: G02B6/26
- IPC: G02B6/26 ; G02B6/138 ; G02B6/30 ; G02B6/12 ; G02B6/122

Abstract:
A method for making optical connections with optical waveguides includes mounting the optical waveguides or a device comprising the optical waveguides, on a component carrier. A partial region of the optical waveguides is embedded in a volume of resist material. Positions of the optical waveguides to be connected are detected with reference to a coordinate system using a measuring system. Favorable, three-dimensional geometries are determined for optical waveguide structures for connecting the optical waveguides to each other at predetermined connecting locations and the optical waveguide structure geometries are converted to a machine-readable dataset. The optical waveguide geometries in the volume of the resist material are three-dimensionally structured using a direct-writing lithography device operating on the basis of the machine-readable dataset. The structured resist material is treated using physical or chemical methods to form at least one optical waveguide structure having ends connected to predetermined connecting locations of the optical waveguides.
Public/Granted literature
- US20130221550A1 Method for producing photonic wire bonds Public/Granted day:2013-08-29
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