Invention Grant
- Patent Title: Method of testing of MEMS devices on a wafer level
- Patent Title (中): 在晶片级测试MEMS器件的方法
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Application No.: US13290764Application Date: 2011-11-07
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Publication No.: US09034666B2Publication Date: 2015-05-19
- Inventor: Vladimir Vaganov , Nickolai Belov
- Applicant: Vladimir Vaganov , Nickolai Belov
- Agency: Fitch, Even, Tabin & Flannery LLP
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G06F3/0338 ; G01L5/16 ; G01L5/22 ; B81C99/00

Abstract:
Some embodiments provide methods, process, systems and apparatus for use in testing multi-axis Micro Electro Mechanical Systems (MEMS) devices. In some embodiments, methods of testing are provided, comprising: selecting, according to a test specification and a test program, at least a first MEMS device on a substrate comprising a plurality of MEMS formed relative to the substrate and applying one or more electrical probes to the first MEMS device; providing power to the first MEMS device through the one or more electrical probes; measuring output signals of the first MEMS device; applying a force to the first MEMS device using a force actuator; measuring a set of output signals of the first MEMS device based on the applied force; and processing test data and generating output test results according to the test specification and test program.
Public/Granted literature
- US20120194207A1 METHOD AND SYSTEM FOR TESTING OF MEMS DEVICES Public/Granted day:2012-08-02
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