Invention Grant
- Patent Title: Connection structure, connection method and differential signal transmission cable
- Patent Title (中): 连接结构，连接方式和差分信号传输电缆
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Application No.: US13693648Application Date: 2012-12-04
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Publication No.: US09035183B2Publication Date: 2015-05-19
- Inventor: Sohei Kodama , Kotaro Tanaka
- Applicant: HITACHI CABLE, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI METALS, LTD.
- Current Assignee: HITACHI METALS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Roberts Mlotkowski Safran & Cole P.C.
- Priority: JP2011-285371 20111227
- Main IPC: H01R9/05
- IPC: H01R9/05 ; H05K1/18 ; H05K3/34
Abstract:
A connection structure for connecting an outer conductor of a differential signal transmission cable to a substrate includes a connecting member including a main body portion and a protruding portion protruding from the main body portion. The outer conductor is connected via the connecting member to the substrate. The connecting member is solder-connected to the outer conductor via the main body portion and is solder-connected to the substrate via the protruding portion.
Public/Granted literature
- US20130161071A1 CONNECTION STRUCTURE, CONNECTION METHOD AND DIFFERENTIAL SIGNAL TRANSMISSION CABLE Public/Granted day:2013-06-27
Information query
