Invention Grant
- Patent Title: Circuit board with flexible region and method for production thereof
- Patent Title (中): 具有柔性区域的电路板及其制造方法
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Application No.: US12997867Application Date: 2009-06-08
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Publication No.: US09035189B2Publication Date: 2015-05-19
- Inventor: Wolfgang Pahl , Hans Krueger , Peter Demmer
- Applicant: Wolfgang Pahl , Hans Krueger , Peter Demmer
- Applicant Address: DE Munich
- Assignee: EPCOS AC
- Current Assignee: EPCOS AC
- Current Assignee Address: DE Munich
- Agency: Cozen O'Connor
- Priority: DE102008028300 20080613
- International Application: PCT/EP2009/057051 WO 20090608
- International Announcement: WO2009/150133 WO 20091217
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18 ; H05K3/46
Abstract:
A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.
Public/Granted literature
- US20110214905A1 Circuit Board with Flexible Region and Method for Production Thereof Public/Granted day:2011-09-08
Information query
