Invention Grant
- Patent Title: Transparent conductive substrate and method for manufacturing same
- Patent Title (中): 透明导电基板及其制造方法
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Application No.: US13973609Application Date: 2013-08-22
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Publication No.: US09035198B2Publication Date: 2015-05-19
- Inventor: Ji Young Hwang , Hyeon Choi , Seung Heon Lee , Sujin Kim , Ki-Hwan Kim
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge, LLP
- Priority: KR10-2011-0097754 20110927
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/11 ; G02B5/18 ; H05K3/10 ; G06F3/044 ; H05K9/00

Abstract:
The present invention provides a transparent conductive substrate comprising: a transparent substrate, and a conductive pattern provided on the transparent substrate, wherein the conductive pattern comprises line breakage portions performing electric breakage, and a pattern of a broken line formed when the line breakage portions are connected comprises an irregular pattern shape. The present invention can minimize a moiré phenomenon and a diffraction phenomenon by external light by performing line breakage of a regular or irregular conductive pattern by using the irregular pattern.
Public/Granted literature
- US20130341079A1 TRANSPARENT CONDUCTIVE SUBSTRATE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2013-12-26
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