Invention Grant
- Patent Title: Method for connecting leader line
- Patent Title (中): 连线方法
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Application No.: US13561814Application Date: 2012-07-30
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Publication No.: US09035214B2Publication Date: 2015-05-19
- Inventor: Yasunori Morimoto , Yoshiyuki Hatayama
- Applicant: Yasunori Morimoto , Yoshiyuki Hatayama
- Applicant Address: JP Tokyo
- Assignee: Sumida Corporation
- Current Assignee: Sumida Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2011-186493 20110829
- Main IPC: B23K26/20
- IPC: B23K26/20 ; B23K26/32 ; B23K1/005 ; H01F41/10 ; H01F27/28 ; H01R43/02

Abstract:
Disclosed is a method for connecting a core wire of a wire rod covered with an insulating coating and pulled out from a coil component with a substrate by irradiating a laser beam, the method comprising the steps of: (a) forming a bond part between the wire rod and the substrate, the bond part being made of a material having a high optical absorptance for laser beam; and (b) irradiating a laser beam on an area to be connected under a state that at least one of the wire rod and the substrate is being pulled toward the other.
Public/Granted literature
- US20130048616A1 METHOD FOR CONNECTING LEADER LINE Public/Granted day:2013-02-28
Information query
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