Invention Grant
- Patent Title: System for thermal control of red LED(s) chips
- Patent Title (中): 红色LED芯片的热控制系统
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Application No.: US13711818Application Date: 2012-12-12
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Publication No.: US09035331B2Publication Date: 2015-05-19
- Inventor: Glenn Howard Kuenzler
- Applicant: GE Lighting Solutions, LLC
- Applicant Address: US OH East Cleveland
- Assignee: GE Lighting Solutions, LLC
- Current Assignee: GE Lighting Solutions, LLC
- Current Assignee Address: US OH East Cleveland
- Agency: GE Global Patent Operation
- Agent Peter T. DiMauro
- Main IPC: H01L29/18
- IPC: H01L29/18 ; H01L33/00 ; H01L27/15 ; H05B33/08 ; H05K1/02 ; F21Y111/00 ; F21Y113/00 ; H05K1/18
Abstract:
A light emitting diode assembly includes a first light emitting diode disposed on a first substrate and a second light emitting diode disposed on a second substrate that is disposed substantially adjacent to the first substrate. The second light emitting diode has a higher rate of performance degradation over time due to temperature than the first light emitting diode. A heat sink is thermally coupled to the first substrate and an electrical cooling circuit is thermally coupled to the second substrate. The electrical cooling circuit is configured to reduce a temperature of the second substrate when the electrical cooling circuit is electrically energized.
Public/Granted literature
- US20140159077A1 SYSTEM FOR THERMAL CONTROL OF RED LED(S) CHIPS Public/Granted day:2014-06-12
Information query
IPC分类:
