Invention Grant
- Patent Title: Light emitting module
- Patent Title (中): 发光模块
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Application No.: US13798126Application Date: 2013-03-13
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Publication No.: US09035335B2Publication Date: 2015-05-19
- Inventor: Sheng-Yuan Sun , Po-Jen Su
- Applicant: Sheng-Yuan Sun , Po-Jen Su
- Applicant Address: TW Tainan
- Assignee: Genesis Photonics Inc.
- Current Assignee: Genesis Photonics Inc.
- Current Assignee Address: TW Tainan
- Agency: Jianq Chyun IP Office
- Priority: TW101114933A 20120426
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L25/075 ; H01L33/20 ; H01L33/50

Abstract:
A light emitting module including a substrate, a plurality of first light emitting diode (LED) chips and a plurality of second LED chips is provided. The substrate has a cross-shaped central region and a peripheral region surrounding the cross-shaped central region. The first LED chips are disposed on the substrate and at least located in the cross-shaped central region. The second LED chips are disposed on the substrate and at least located in the peripheral region. A size of each second LED chip is smaller than a size of each first LED chip. The number of the first LED chips located in the peripheral region is smaller than that in the cross-shaped central region. The number of the second LED chips located in the cross-shaped central region is smaller than that in the peripheral region.
Public/Granted literature
- US20130285083A1 LIGHT EMITTING MODULE Public/Granted day:2013-10-31
Information query
IPC分类: