Invention Grant
- Patent Title: Light emitting device package
- Patent Title (中): 发光装置封装
-
Application No.: US14045399Application Date: 2013-10-03
-
Publication No.: US09035343B2Publication Date: 2015-05-19
- Inventor: Sung-Uk Zhang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0153707 20121226
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/60 ; H01L33/54
Abstract:
A light emitting device package is provided. The light emitting device includes: a substrate; a light emitting device disposed at one side of the substrate; and a formation layer formed on the substrate and having a slope at an edge portion of the formation layer.
Public/Granted literature
- US20140175487A1 LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2014-06-26
Information query
IPC分类:
