Invention Grant
US09035380B2 High voltage drain-extended MOSFET having extra drain-OD addition
有权
具有额外漏极OD外加的高压漏极扩展MOSFET
- Patent Title: High voltage drain-extended MOSFET having extra drain-OD addition
- Patent Title (中): 具有额外漏极OD外加的高压漏极扩展MOSFET
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Application No.: US13686696Application Date: 2012-11-27
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Publication No.: US09035380B2Publication Date: 2015-05-19
- Inventor: Yi-Sheng Chen , Chen-Liang Chu , Shih-Kuang Hsiao , Fei-Yun Chen , Kong-Beng Thei
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78

Abstract:
An integrated circuit includes a high-voltage well having a first doping type, a first doped region and a second doped region embedded in the high-voltage well, the first and second doped regions having a second doping type and spaced apart by a channel in the high-voltage well, source/drain regions formed in the first doped region and in the second doped region, each of the source/drain regions having the second doping type and more heavily doped than the first and second doped regions, first isolation regions spaced apart from each of the source/drain regions, and resistance protection oxide forming a ring surrounding each of the source/drain regions.
Public/Granted literature
- US20140145261A1 High Voltage Drain-Extended MOSFET Having Extra Drain-OD Addition Public/Granted day:2014-05-29
Information query
IPC分类: