Invention Grant
- Patent Title: Semiconductor structure profile
- Patent Title (中): 半导体结构剖面
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Application No.: US13799227Application Date: 2013-03-13
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Publication No.: US09035382B2Publication Date: 2015-05-19
- Inventor: Che-Cheng Chang , Jr-Jung Lin , Yi-Jen Chen , Yung Jung Chang
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66

Abstract:
One or more embodiments of techniques or systems for forming a semiconductor structure are provided herein. In some embodiments, a semiconductor structure includes a substrate, a first lightly doped drain (LDD), a second LDD, an interface layer (IL), a high-k stack, a gate region, a dummy poly region, a first hard mask (HM) region, a second HM region, and a seal spacer region. The HK stack has a HK stack width and the gate region has a gate region width that is less than or substantially equal to the HK stack width. Because of the increased width of the HK stack, some of the HK stack likely overlaps some of the first LDD or the second LDD. In this manner, a saturation current and a threshold voltage associated with the semiconductor structure are improved. The increased width of the HK stack also protects more of the IL during LDD implanting.
Public/Granted literature
- US20140264589A1 SEMICONDUCTOR STRUCTURE PROFILE Public/Granted day:2014-09-18
Information query
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