Invention Grant
US09035449B2 Package member assembly, method for manufacturing the package member assembly, package member, and method for manufacturing piezoelectric resonator device using the package member
有权
封装构件组件，用于制造封装构件组件的方法，封装构件以及使用封装构件制造压电谐振器装置的方法
- Patent Title: Package member assembly, method for manufacturing the package member assembly, package member, and method for manufacturing piezoelectric resonator device using the package member
- Patent Title (中): 封装构件组件，用于制造封装构件组件的方法，封装构件以及使用封装构件制造压电谐振器装置的方法
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Application No.: US13203037Application Date: 2010-04-02
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Publication No.: US09035449B2Publication Date: 2015-05-19
- Inventor: Syunsuke Satoh , Naoki Kohda , Hiroki Yoshioka
- Applicant: Syunsuke Satoh , Naoki Kohda , Hiroki Yoshioka
- Applicant Address: JP Kakogawa-shi
- Assignee: DAISHINKU CORPORATION
- Current Assignee: DAISHINKU CORPORATION
- Current Assignee Address: JP Kakogawa-shi
- Agency: Mots Law, PLLC
- Agent Marvin A. Motsenbocker
- Priority: JP2009-090623 20090403
- International Application: PCT/JP2010/056055 WO 20100402
- International Announcement: WO2010/114115 WO 20101007
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/498 ; H01L41/22 ; H03H9/10 ; H01L41/311 ; H03H3/02 ; H03H9/05
Abstract:
[Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face and a back main face of a wafer made of glass, and external terminals connected to side-face conductors attached to inner wall faces of the bottomed holes on the back main face.
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