Invention Grant
- Patent Title: Acoustic wave device and multilayered substrate
- Patent Title (中): 声波装置和多层基板
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Application No.: US13666520Application Date: 2012-11-01
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Publication No.: US09035535B2Publication Date: 2015-05-19
- Inventor: Takashi Yamashita
- Applicant: Taiyo Yuden Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2011-260972 20111129
- Main IPC: H01L41/053
- IPC: H01L41/053 ; H03H3/08 ; H03H9/02 ; H03H9/05 ; H03H9/10

Abstract:
An acoustic wave device includes: a substrate; a functional element that is located on the substrate and excites acoustic waves; a side wall portion that is made of a metal and is located on the substrate so as to surround the functional element; a metal plate that is located above the functional element and the side wall portion, and seals the functional element so that a space is formed above the functional element; and a terminal that is located on the substrate and further out than the side wall portion, and is electrically connected to the functional element.
Public/Granted literature
- US20130134831A1 ACOUSTIC WAVE DEVICE AND MULTILAYERED SUBSTRATE Public/Granted day:2013-05-30
Information query
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