Invention Grant
US09035674B2 Structure and method for determining a defect in integrated circuit manufacturing process
有权
用于确定集成电路制造过程中的缺陷的结构和方法
- Patent Title: Structure and method for determining a defect in integrated circuit manufacturing process
- Patent Title (中): 用于确定集成电路制造过程中的缺陷的结构和方法
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Application No.: US13323634Application Date: 2011-12-12
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Publication No.: US09035674B2Publication Date: 2015-05-19
- Inventor: Hong Xiao , Jack Y. Jau , Chang Chun Yeh
- Applicant: Hong Xiao , Jack Y. Jau , Chang Chun Yeh
- Applicant Address: TW Hsin-Chu
- Assignee: HERMES MICROVISION, INC.
- Current Assignee: HERMES MICROVISION, INC.
- Current Assignee Address: TW Hsin-Chu
- Agency: WPAT, PC
- Agent Justin King
- Main IPC: H01L21/66
- IPC: H01L21/66
Abstract:
The present invention discloses a structure and method for determining a defect in integrated circuit manufacturing process, wherein the structure comprises a plurality of normal active areas formed in a plurality of first arrays and a plurality of defective active areas formed in a plurality of second arrays. The first arrays and second arrays are interlaced, and the defect is determined by monitoring a voltage contrast from a charged particle microscope image of the active areas.
Public/Granted literature
- US20120083055A1 STRUCTURE AND METHOD FOR DETERMINING A DEFECT IN INTEGRATED CIRCUIT MANUFACTURING PROCESS Public/Granted day:2012-04-05
Information query
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