Invention Grant
- Patent Title: Printed wiring board (PWB) for high amperage circuits
- Patent Title (中): 印刷电路板(PWB),用于高电流电路
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Application No.: US13433388Application Date: 2012-03-29
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Publication No.: US09036355B2Publication Date: 2015-05-19
- Inventor: Jeffrey T. Wavering , Rainer J. Seidel , Norbert J. Simper , Josef Maier , Carl A. Wagner , Michael Krenz , Michael William Foster
- Applicant: Jeffrey T. Wavering , Rainer J. Seidel , Norbert J. Simper , Josef Maier , Carl A. Wagner , Michael Krenz , Michael William Foster
- Applicant Address: US CT Windsor Locks
- Assignee: Hamilton Sundstrand Corporation
- Current Assignee: Hamilton Sundstrand Corporation
- Current Assignee Address: US CT Windsor Locks
- Agency: Cantor Colburn LLP
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18 ; H05K7/00 ; H01R9/00 ; H05K1/02

Abstract:
A printed wiring board (PWB) includes a substrate having first and second opposing surfaces and a busbar coupled to the substrate. The busbar includes a power input connector and a cross-sectional dimension configured and disposed to carry at least 100 amperes. At least one semiconductor device is mounted to the busbar. The at least one semiconductor device includes an input electrically coupled to the busbar and an output. One or more output conductors are electrically coupled to the output of the at least one semiconductor device. The one or more output conductors include a cross-sectional dimension configured and disposed to carry at least 50 amperes.
Public/Granted literature
- US20130258626A1 PRINTED WIRING BOARD (PWB) FOR HIGH AMPERAGE CIRCUITS Public/Granted day:2013-10-03
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