Invention Grant
- Patent Title: System and method for thermal management in a portable computing device using thermal resistance values to predict optimum power levels
- Patent Title (中): 使用热电阻值预测最佳功率电平的便携式计算设备中的热管理系统和方法
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Application No.: US13779153Application Date: 2013-02-27
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Publication No.: US09037882B2Publication Date: 2015-05-19
- Inventor: Unnikrishnan Vadakkanmaruveedu , Paras S. Doshi , Ankur Jain , Vinay Mitter , Richard A. Stewart
- Applicant: QUALCOMM INCORPORATED
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Smith Risley Tempel Santos LLC
- Main IPC: G06F1/00
- IPC: G06F1/00 ; G06F1/26 ; G06F1/20 ; G06F1/32

Abstract:
Various embodiments of methods and systems for thermal energy management in a portable computing device (“PCD”) based on power level calculations are disclosed. An exemplary method includes tracking instantaneous operating temperatures and active power supply levels to one or more components. With an estimate or measurement of ambient temperature, the instantaneous operating temperature values and active power supply level values can be used to calculate an instantaneous thermal resistance value. In the event that thermal energy generation should be managed, a target operating temperature may be used with the ambient temperature and the instantaneous thermal resistance value to solve for an optimum power supply level. The active power supply level may then be adjusted based on the calculated optimum power supply level.
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