Invention Grant
- Patent Title: High pressure relief valve spring assembly
- Patent Title (中): 高压溢流阀弹簧组件
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Application No.: US13658099Application Date: 2012-10-23
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Publication No.: US09038662B2Publication Date: 2015-05-26
- Inventor: Aaron Rickis , Francis P. Marocchini
- Applicant: Hamilton Sundstrand Corporation
- Applicant Address: US CT Windsor Locks
- Assignee: Hamilton Sunstrand Corporation
- Current Assignee: Hamilton Sunstrand Corporation
- Current Assignee Address: US CT Windsor Locks
- Agency: Carlson, Gaskey & Olds, PC
- Main IPC: F16K17/00
- IPC: F16K17/00 ; F16K17/04 ; F16K15/02
Abstract:
In one featured embodiment, a spring assembly for a valve comprises a spring, a spring seat including a cup-shaped portion for seating one end of the spring, and a ball received within a recess formed within the cup-shaped portion of the spring seat. The ball is defined by a ball diameter. A disc prevents the ball from contacting a piston. The disc is defined by an outer diameter and includes a center opening defined by an inner diameter. A ratio of the inner diameter to the ball diameter is between 0.60 and 0.65.
Public/Granted literature
- US20140109983A1 High Pressure Relief Valve Spring Assembly Public/Granted day:2014-04-24
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