Invention Grant
- Patent Title: Removable endwall plate for electrical panels or enclosures
- Patent Title (中): 电气面板或外壳的可拆卸端壁板
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Application No.: US12731607Application Date: 2010-03-25
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Publication No.: US09038837B2Publication Date: 2015-05-26
- Inventor: Kristopher Scott Robinson , Jeffrey K. Hudgins, Jr. , Arthur Shumate , Brian J. Rusch
- Applicant: Kristopher Scott Robinson , Jeffrey K. Hudgins, Jr. , Arthur Shumate , Brian J. Rusch
- Applicant Address: US GA Alpharetta
- Assignee: Siemens Industry, Inc.
- Current Assignee: Siemens Industry, Inc.
- Current Assignee Address: US GA Alpharetta
- Main IPC: H02G3/08
- IPC: H02G3/08 ; B65D90/02 ; B65D88/10 ; B65D90/26

Abstract:
The present invention relates generally to electrical panels or enclosures. More particularly, the invention encompasses a removable endwall plate for electrical panels or enclosures. The present invention is also directed to a novel electrical panel or enclosure where an endwall is removably attached to a frame. The endwall can be removed and can be cut at desired locations to create holes or openings for electrical components. The removable endwall can also have one or more knockouts which can be removed from the endwall as needed. One could also have at least one knockout within the knockout.
Public/Granted literature
- US20100258559A1 Removable Endwall Plate For Electrical Panels or Enclosures Public/Granted day:2010-10-14
Information query
IPC分类: