Invention Grant
US09038998B2 Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations
有权
导线和带状接合操作期间半导体器件的支撑结构和夹持系统
- Patent Title: Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations
- Patent Title (中): 导线和带状接合操作期间半导体器件的支撑结构和夹持系统
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Application No.: US13510151Application Date: 2010-11-16
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Publication No.: US09038998B2Publication Date: 2015-05-26
- Inventor: Jonathan Michael Byars
- Applicant: Jonathan Michael Byars
- Applicant Address: US CA Irvine
- Assignee: Orthodyne Electronics Corporation
- Current Assignee: Orthodyne Electronics Corporation
- Current Assignee Address: US CA Irvine
- Agency: Stradley Ronon Stevens & Young, LLP
- International Application: PCT/US2010/056830 WO 20101116
- International Announcement: WO2012/096638 WO 20120719
- Main IPC: B23Q3/00
- IPC: B23Q3/00 ; H01L23/00
Abstract:
A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.
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Information query
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