A method for producing an inkjet head may include, the inkjet head having: a head substrate having a plurality of piezoelectric elements, a wiring substrate having wiring lines through which electric power is fed to the respective piezoelectric elements through the drive electrodes, the method having: pressure-welding the wiring substrate to the head substrate by heat through resin adhesive sections made of a thermosetting resin so that the drive electrodes are electrically connected to the wiring lines through solder bumps; and joining the head substrate to the wiring substrate, wherein a melting point TB[° C.] of the solder bumps and a cure initiation temperature TR[° C.] of the resin adhesion sections meet a relation (TR[° C.]≦TB[° C.]≦TR+30[° C.]).