Invention Grant
- Patent Title: Bonding using hot-melt adhesives
- Patent Title (中): 使用热熔胶粘接
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Application No.: US13793377Application Date: 2013-03-11
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Publication No.: US09039862B2Publication Date: 2015-05-26
- Inventor: Juergen Lotz , Dirk Kasper , Lutz Pielert
- Applicant: HENKEL AG & CO. KGAA
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL AG & CO. KGAA
- Current Assignee: HENKEL AG & CO. KGAA
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Priority: DE102010041463 20100927
- Main IPC: C09J123/12
- IPC: C09J123/12 ; B32B7/12 ; B32B29/02 ; B32B15/08 ; C09J123/14 ; B32B29/00 ; C08L23/14 ; C08K5/134 ; C08L91/06
Abstract:
The invention relates to the use of a hot-melt adhesive having high hardness for adhesive bonding of metal films or foils, paper films or foils, and/or plastic films or foils. The invention further relates to a method for adhesively bonding a metal film or foil, paper film or foil, and/or plastic film or foil onto a substrate.
Public/Granted literature
- US20130186566A1 BONDING USING HOT-MELT ADHESIVES Public/Granted day:2013-07-25
Information query
IPC分类:
