Invention Grant
- Patent Title: Microstructure manufacturing method
- Patent Title (中): 微结构制造方法
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Application No.: US13399651Application Date: 2012-02-17
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Publication No.: US09040227B2Publication Date: 2015-05-26
- Inventor: Takayuki Teshima , Yutaka Setomoto
- Applicant: Takayuki Teshima , Yutaka Setomoto
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A. Inc., IP Division
- Priority: JP2011-038559 20110224
- Main IPC: G03F1/58
- IPC: G03F1/58 ; C25D5/12 ; G02B5/18

Abstract:
A microstructure manufacturing method includes forming a layer of a photosensitive resin on a substrate surface having an electrical conductivity, forming a structure of the photosensitive resin by exposing the layer of the photosensitive resin to light and developing the layer of the photosensitive resin to expose a part of the substrate surface, forming a first plated layer on the exposed part of the substrate surface by soaking the structure of the photosensitive resin in a first plating solution, curing the structure of the photosensitive resin after forming the first plated layer, removing at least part of the first plated layer after curing the structure of the photosensitive resin, and forming a second plated layer on a part where the first plated layer is removed, by soaking the structure of the photosensitive resin in a second plating solution different from the first plating solution.
Public/Granted literature
- US20120219916A1 MICROSTRUCTURE MANUFACTURING METHOD Public/Granted day:2012-08-30
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