- Patent Title: Pattern forming method, multi-layered resist pattern, multi-layered film for organic solvent development, manufacturing method of electronic device, and electronic device
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Application No.: US14257314Application Date: 2014-04-21
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Publication No.: US09040231B2Publication Date: 2015-05-26
- Inventor: Keita Kato , Michihiro Shirakawa , Tadahiro Odani , Atsushi Nakamura , Hidenori Takahashi , Kaoru Iwato
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-236456 20111027
- Main IPC: G03F7/26
- IPC: G03F7/26 ; G03F7/09 ; G03F7/095 ; G03F7/039 ; G03F7/20 ; G03F7/32
Abstract:
A pattern forming method contains: (i) a step of forming a bottom anti-reflective coating on a substrate by using a first resin composition (I), (ii) a step of forming a resist film on the bottom anti-reflective coating by using a second resin composition (II), (iii) a step of exposing a multi-layered film having the bottom anti-reflective coating and the resist film, and (iv) a step of developing the bottom anti-reflective coating and the resist film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.
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