Invention Grant
- Patent Title: Laser ablation technique for electrical contact to buried electrically conducting layers in diamond
- Patent Title (中): 激光烧蚀技术，用于电接触金刚石中的埋地导电层
-
Application No.: US13801495Application Date: 2013-03-13
-
Publication No.: US09040345B2Publication Date: 2015-05-26
- Inventor: Bradford B. Pate , Matthew P. Ray , Jeffrey W. Baldwin
- Applicant: Bradford B. Pate , Matthew P. Ray , Jeffrey W. Baldwin
- Applicant Address: US DC Washington
- Assignee: The United States of America, as represented by the Secretary of the Navy
- Current Assignee: The United States of America, as represented by the Secretary of the Navy
- Current Assignee Address: US DC Washington
- Agency: US Naval Research Laboratory
- Agent Stephen T. Hunnius
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H05K3/46 ; B23K26/00 ; B23K26/06 ; B23K26/36 ; B23K26/40 ; H01L23/373 ; H05K3/00
Abstract:
A method of laser ablation for electrical contact to a buried electrically conducting layer in diamond comprising polishing a single crystal diamond substrate having a first carbon surface, implanting the diamond with a beam of 180 KeV followed by 150 KeV C+ ions at fluencies of 4×1015 ions/cm2 and 5×1015 ions/cm2 respectively, forming an electrically conducting carbon layer beneath the first carbon surface, and ablating the single crystal diamond which lies between the electrically conducting layer and the first carbon surface.
Public/Granted literature
- US20130248225A1 Laser Ablation Technique for Electrical Contact to Buried Electrically Conducting Layers in Diamond Public/Granted day:2013-09-26
Information query
IPC分类:
