Invention Grant
- Patent Title: Semiconductor packaging method using connecting plate for internal connection
- Patent Title (中): 半导体封装方法采用连接板进行内部连接
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Application No.: US14083277Application Date: 2013-11-18
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Publication No.: US09040357B2Publication Date: 2015-05-26
- Inventor: Jun Lu , Kai Liu , Yan Xun Xue
- Applicant: Alpha and Omega Semiconductor Incorporated
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha & Omega Semiconductor, Inc.
- Current Assignee: Alpha & Omega Semiconductor, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: CH Emily LLC
- Agent Chein-Hwa Tsao
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/495 ; H01L23/00 ; H01L25/07 ; H01L23/31
Abstract:
A semiconductor package with connecting plate for internal connection comprise: a plurality of chips each having a plurality of contact areas on a top surface; one or more connecting plates having a plurality of electrically isolated connecting plate portions each connecting a contact area of the semiconductor chips. The method of making the semiconductor package includes the steps of connecting one or more connecting plates to a plurality of semiconductor chips, applying a molding material to encapsulate the chips and the connecting plates, separating a plurality of connecting plate portions of the connecting plates by shallow cutting through or by grinding.
Public/Granted literature
- US20140080263A1 Semiconductor Packaging Method Using Connecting Plate for Internal Connection Public/Granted day:2014-03-20
Information query
IPC分类:
