Invention Grant
- Patent Title: Multilayered wiring board and method for fabricating the same
- Patent Title (中): 多层布线板及其制造方法
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Application No.: US13482784Application Date: 2012-05-29
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Publication No.: US09040836B2Publication Date: 2015-05-26
- Inventor: Junichi Nakamura , Yuji Kobayashi , Mikio Yamagiwa
- Applicant: Junichi Nakamura , Yuji Kobayashi , Mikio Yamagiwa
- Applicant Address: JP Nagano-shi, Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano-shi, Nagano
- Agency: Drinker Biddle & Reath LLP
- Priority: JPP.2005-247862 20050829; JPP.2006-122115 20060426
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K3/46 ; H01L21/683 ; H05K3/20 ; H05K3/42
Abstract:
In a multilayered wiring board constituted by laminating to form pluralities of layers of wiring layers 105, 108, 110 and insulating layers 104, 106, 107, in the plurality of laminated insulating layers 104, 106, 107, the insulating layer 106 disposed at a laminating center in a laminating direction is made to constitute an insulating layer with a reinforcing member including a reinforcing member.
Public/Granted literature
- US20120293973A1 MULTILAYERED WIRING BOARD AND METHOD FOR FABRICATING THE SAME Public/Granted day:2012-11-22
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